Services:

1. design, manufacture and implementation of glass and metallic X-ray capillaries for micro-beam formation for techniques such as XRF, XPS, ARPES.

2. manufacture of X-ray capillaries for specific application, with regard to the specific light source.

3. deposition of layers and bilayers by magnetron sputtering and effusion cell deposition with strictly controlled thickness on flat substrates (silicon, glass, plastics, etc.) and those of unusual shapes such as thin wires.

4. full characterization of surface morphology (AFM, optical profilometer, mechanical profilometer) and the chemical composition and thickness of layers/dual layers (optical, mechanical, AFM, TOF-SIMS profilometer).

5. deposition of metallic layers: copper, nickel, gold by electro-deposition in a highly controlled manner (thickness, tensile stress, morphology).

6. deposition of layers on non-standard samples: thin wires, rollers, items with non-standard shapes.

7. morphological characterization of surfaces in the nanoscale using an atomic force microscope equipped with an efficient automated measuring table for measuring large samples.

8. characterization of organic layers and multilayers using time-of-flight detector mass spectometry (TOF-SIMS).

Equipment:

Vacuum system for the deposition of metallic thin films (PREVAC), XSP spectrometer, R4000 analyser, Scienta, two magnetron sources, two effusion cells.

Atomic force microscope LS5600 (Agilent): two AFM scanners: 1. XY range- 100 um, Z<10um, noise (Z axis) < 0, 05 nm; 2. XY range -9 um, Z< 10 um, noise (Z axis)< 0, 02 nm and STM scanner. Automated sample table with an XY range of 200 mm. Sample height up to 5 cm, maximum weight6 1 kg. Size < 30x30cm.

Optical profilometer WYKO 9800NT (Veeco).

Automated sample table with an XY range of 200 mm. Sample height up to 10 cm, maximum weight 10 kg. Size <30x30 cm.

Secondary ion mass spectrometer with a TOF-SIMS.5 ion transit time detector (ION-TOF) equipped with a vacuum chamber for measuring samples up to 10 cm in lenght, a bismuth cluster gun with a beam energy of up to 30 keV, an argon cluster gun for measurements and surface etching, a dual-source ion gun (Cs and o2) forn surface etching.

μ-X-ray flourescence spectrometer (μ-XRF), own construction, beam size less than 25 μm for X-ray sources using Cu (E=8,9 keV) and Mo (E=17 keV) anode tubes.

Digital galvanostat/potentiostat Autolab 302N, 128 N (Eco Chemie).

KSV701 strain gauge (KSV).